Organic light emitting display panel and organic light emitting display device

ABSTRACT

An OLED panel and an OLED device are provided. The OLED panel includes a display area and a non-display area around the display area; a substrate, a driving device layer and a light emitting device layer arranged in the display area, and the driving device layer includes multiple thin film transistors, the light emitting device layer includes multiple organic light emitting diodes, and an encapsulation layer covering the light emitting device layer. The non-display area includes an electrostatic discharge portion, the electrostatic discharge portion is made of a transparent conductive thin film and is located on a side of the encapsulation layer facing away from the substrate. The non-display area includes at least one blocking portion, the blocking portion is arranged around the display area, and is located between the substrate and the encapsulation layer.

CROSS REFERENCE TO RELATED APPLICATION

The present application claims the priority to Chinese PatentApplication No. 201810639409.6, titled “ORGANIC LIGHT EMITTING DISPLAYPANEL AND ORGANIC LIGHT EMITTING DISPLAY DEVICE”, filed on Jun. 20, 2018with the State Intellectual Property Office of the PRC, which isincorporated herein by reference in its entirety.

FIELD

The present disclosure relates to the technical field of display, andparticularly to an organic light emitting display panel and an organiclight emitting display device.

BACKGROUND

In human sensory organs, eyes accept most information. In production andlife, people need to use increasingly abundant visual information.Therefore, the display technique plays a very important role in thecurrent human society. Since the emergence of the display technique, thetechnique develops rapidly. Cathode ray tube technology (CRT), plasmadisplay panel (PDP), liquid crystal display (LCD), even the latestorganic light emitting display (OLED) and micro light emitting diode(micro LED) display technique emerge successively.

With the development of the society and the increasing requirement formaterial life of human, the current display technique develops quicklytowards the directions of narrow bezel, high contrast, high resolution,full color display, low power consumption, high reliability, longservice life, and being thin and light. The research of OLED displaytechnique constantly improves.

The OLED panel can be applied in multiple fields, such as a rollabledisplay device, a flexible wearable device, and a foldable displaydevice. How to continuously improve the reliability and reduce the costfor the OLED panel is a problem to be solved in the display industry.

SUMMARY

In view of above, an OLED panel and an OLED device are providedaccording to embodiments of the present disclosure.

An OLED panel is provided according to the embodiments of the presentdisclosure, which includes: a display area and a non-display area aroundthe display area; a substrate; a driving device layer and a lightemitting device layer arranged above the substrate, where the drivingdevice layer and the light emitting device layer are located in thedisplay area, the driving device layer includes multiple thin filmtransistors, the light emitting device layer includes multiple organiclight emitting diodes; and an encapsulation layer covering the lightemitting device layer. The non-display area includes an electrostaticdischarge portion, the electrostatic discharge portion is made of atransparent conductive thin film and is located on a side of theencapsulation layer facing away from the substrate. The non-display areaincludes at least one blocking portion, the blocking portion is arrangedaround the display area, and is located between the substrate and theencapsulation layer. The electrostatic discharge portion and theblocking portion at least partially overlap in a direction perpendicularto the substrate.

An OLED device is further provided according to the embodiments of thepresent disclosure, which includes the OLED panel according to theembodiments of the present disclosure.

Compared with the conventional technology, the OLED panel and the OLEDdevice provided according to the embodiments of the present disclosurehave at least the following beneficial effects.

The electrostatic discharge portion can discharge static electricityfrom outside of the OLED panel. The electrostatic discharge portion isarranged in the non-display area and many circuit structures andelectronic elements are arranged in the display area, thereby preventinginterference on the circuit structures and electronic elements in thedisplay area from the electrostatic discharge portion.

The electrostatic discharge portion is located on the side of theencapsulation layer facing away from the substrate. In the non-displayarea, some signal wires or driving circuits are usually arranged betweenthe encapsulation layer and the substrate, and the side of theencapsulation layer facing away from the substrate generally has asimple structure. In order not to increase a width of the non-displayarea, the electrostatic discharge portion is arranged on the side of theencapsulation layer facing away from the substrate, which is beneficialto achieve a narrow frame of the OLED panel.

The electrostatic discharge portion is made of the transparentconductive thin film. The transparent conductive thin film is a materialcommonly used in the OLED panel. Since a manufacturing process of thetransparent conductive thin film is relatively mature, a processdifficulty of manufacturing the electrostatic discharge portion can bereduced, and a manufacturing cost of the OLED panel is reduced.

In the direction perpendicular to the substrate, the electrostaticdischarge portion at least partially overlaps with the blocking portion.When the external static electricity enters the OLED panel, the staticelectricity passes the electrostatic discharge portion arranged in thenon-display area. The electrostatic discharge portion discharges thestatic electricity to prevent that the external static electricitydamages the blocking portion. Therefore, a failure of the blockingportion is prevented and a reliability of the OLED panel is improved.

Practically, any product according to the embodiments of the presentdisclosure is unnecessary to achieve all of the technical effectsdescribed above.

BRIEF DESCRIPTION OF THE DRAWINGS

Drawings incorporated in the specification and constituting a part ofthe specification illustrate the embodiments of the present disclosure,and are used together with its description to explain the principle ofthe present disclosure.

FIG. 1 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure;

FIG. 2 is a schematic view showing a sectional structure of the OLEDpanel along a line CC′ in FIG. 1;

FIG. 3 is a schematic view showing a planar structure of an OLED panelaccording to another embodiment of the present disclosure;

FIG. 4 is a schematic view showing a sectional structure of the OLEDpanel along a line DD′ in FIG. 3;

FIG. 5 is a schematic view showing another sectional structure of theOLED panel along the line DD′ in FIG. 3;

FIG. 6 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure;

FIG. 7 is a schematic view showing a sectional structure of the OLEDpanel along a line GG′ in FIG. 6;

FIG. 8 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure;

FIG. 9 is a schematic view showing another sectional structure of theOLED panel along the line DD′ in FIG. 3;

FIG. 10 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure;

FIG. 11 is a schematic view showing a sectional structure of an OLEDpanel according to an embodiment of the present disclosure:

FIG. 12 is a schematic view showing a sectional structure of the OLEDpanel along a line EE′ in FIG. 10:

FIG. 13 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure:

FIG. 14 is a schematic view showing a sectional structure of the OLEDpanel along a line FF′ in FIG. 13;

FIG. 15 is a schematic view showing a sectional structure of an OLEDpanel according to an embodiment of the present disclosure:

FIG. 16 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure;

FIG. 17 is a schematic view showing a sectional structure of the OLEDpanel along a line GG′ in FIG. 16;

FIG. 18 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure;

FIG. 19 is schematic view showing a local amplification structure of anarea X in FIG. 18;

FIG. 20 is a schematic view showing a sectional structure of the OLEDpanel along a line HH′ in FIG. 18;

FIG. 21 is a schematic view showing a planar structure of an OLED panelaccording to an embodiment of the present disclosure; and

FIG. 22 is a schematic structural view of an OLED device according to anembodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various exemplary embodiments of the present disclosure are described indetail in conjunction with the drawings. It should be noted that unlessotherwise specified, the relative arrangement of components and steps,numeric expressions, and numeric values illustrated in the embodimentsare not intended to limit the scope of the present disclosure.

Description for the at least one exemplary embodiment in the followingis merely illustrative and is not intended to limit the presentdisclosure and its application or use.

Any value in the examples illustrated and discussed here should beinterpreted as exemplary rather than limitation. Therefore, differentvalues may be used in other examples of the exemplary embodiments.

It should be noted that similar labels and letters in the followingdrawings represent similar items. Therefore, once an item is defined inone drawing, the item is not required to be further discussed infollowing drawings.

As illustrated in FIG. 1 and FIG. 2, an OLED panel is provided accordingto an embodiment of the present disclosure. The OLED panel includes: adisplay area AA, and a non-display area NA around the display area; asubstrate 00; a driving device layer 10 and a light emitting devicelayer 20 arranged above the substrate 00, where the driving device layer10 and the light emitting device layer 20 are located in the displayarea AA, the driving device layer 10 includes multiple thin filmtransistors 11, the light emitting device layer 20 includes multipleorganic light emitting diodes 21; and an encapsulation layer 30 coveringthe light emitting device layer 20. The non-display area NA includes anelectrostatic discharge portion 40. The electrostatic discharge portion40 is made of a transparent conductive thin film and is located on aside of the encapsulation layer 30 facing away from the substrate 00.The non-display area NA includes at least one blocking portion 50. Theblocking portion 50 is arranged around the display area AA, and islocated between the substrate 00 and the encapsulation layer 30. Theelectrostatic discharge portion 40 and the blocking portion 50 at leastpartially overlap in a direction perpendicular to the substrate 00.

In the OLED panel according to the embodiment of the present disclosure,a buffer layer bf may be arranged between the substrate 00 and thedriving device layer 10.

Circuit structures, such as driving circuits and signal lines, arearranged on the driving device layer 10. For example, the driving devicelayer 10 includes multiple thin film transistors 11. The thin filmtransistor 11 includes a gate, an active layer, a source, and a drain.FIG. 2 only illustrates one thin film transistor 11 to describe a filmstructure of the driving device layer 10. It should be understood thatthe display area AA includes multiple thin film transistors 11.

The OLED panel is a self-luminous display panel. The light emittingdevice layer 20 includes a light emitting element. Specifically, thelight emitting element is an organic light emitting diode (OLED) 21. TheOLED 21 includes an anode, a cathode, and a luminescent materialarranged between the anode and the cathode. FIG. 2 only illustrates oneOLED 21 to describe a film structure of the light emitting device layer20. It should be understood that the display area AA includes multipleOLEDs 21.

The encapsulation layer 30 has a function of isolating air.Specifically, the encapsulation layer 30 can isolate water vapor,oxygen, and impurities in air to prevent the OLED panel from beingcorroded and damaged. The encapsulation layer 30 may be hard orflexible. FIG. 2 only shows that the encapsulation layer 30 is a hardcover plate, for example.

The blocking portion 50 is arranged between the substrate 00 and theencapsulation layer 30 to prevent air from entering into inside of theOLED panel from a lateral surface of the OLED panel. The blockingportion 50 can isolate water vapor, oxygen, and impurities in air toprevent the OLED display panel from being corroded and damaged. Theblocking portion 50 is arranged around the display area AA. In oneembodiment, the blocking portion 50 is a closed loop. The number of theblocking portions 50 may be one, two, or more to enhance the function ofisolation.

The OLED panel provided in the embodiment of the present disclosureincludes the electrostatic discharge portion 40. The electrostaticdischarge portion 40 can discharge static electricity from outside ofthe OLED panel. The electrostatic discharge portion 40 is arranged inthe non-display area NA and many circuit structures and electronicelements are arranged in the display area AA, thereby preventinginterference on the circuit structures and electronic elements in thedisplay area AA from the electrostatic discharge portion 40.

The electrostatic discharge portion 40 is located on the side of theencapsulation layer 30 facing away from the substrate 00. In thenon-display area NA, some signal lines or driving circuits are usuallyarranged between the encapsulation layer 30 and the substrate 00, andthe side of the encapsulation layer 30 facing away from the substrate 00generally has a simple structure. In order not to increase a width ofthe non-display area NA, the electrostatic discharge portion 40 isarranged on the side of the encapsulation layer 30 facing away from thesubstrate 00, which is beneficial to achieve a narrow frame of the OLEDpanel.

The electrostatic discharge portion 40 is made of the transparentconductive thin film. The transparent conductive thin film is a materialcommonly used in the OLED panel. Since a manufacturing process of thetransparent conductive thin film is relatively mature, a processdifficulty of manufacturing the electrostatic discharge portion 40 canbe reduced, and a manufacturing cost of the OLED panel is reduced.

In one embodiment, the transparent conductive thin film may be made ofat least one of indium oxide, zinc oxide, tin oxide and gallium oxide.For example, the electrostatic discharge portion 40 may be made ofindium tin oxide (ITO).

In the direction perpendicular to the substrate 00, the electrostaticdischarge portion 40 at least partially overlaps with the blockingportion 50. When the external static electricity enters the OLED panel,the static electricity passes the electrostatic discharge portion 40arranged in the non-display area NA. The electrostatic discharge portion40 discharges the static electricity. The static electricity cannot passthe encapsulation layer 30 and the blocking portion 50 to reach otherfilm structures of the OLED panel, thereby preventing the externalstatic electricity from damaging the blocking portion 50. Therefore, afailure of the blocking portion 50 is prevented and a reliability of theOLED panel is improved.

FIG. 1 only shows that the electrostatic release portion 40 is a closedloop, and is arranged around the display area AA, for example. In oneembodiment, the electrostatic discharge portion 40 may be a non-closedsemi-loop or have other shapes, which is not limited in the embodimentof the present disclosure.

In some embodiments, as illustrated in FIG. 3 and FIG. 4, the OLED panelfurther includes a touch layer T located on the side of theencapsulation layer 30 facing away from the substrate 00. The touchlayer T includes a touch electrode TP and a touch wire TL. Theelectrostatic discharge portion 40 and the touch electrode TP containthe same material and are arranged on the same layer.

In the embodiment, the OLED panel has a touch function. The touch layerT is configured to realize the touch function. For example, the touchlayer T may detect information of a touch location. The touch layer Tincludes the touch electrode TP and the touch wire TL. The touchelectrode TP and the touch wire TL are electrically connected. The touchwire transmits an electrical signal for the touch electrode TP. Thetouch electrode TP is usually made of a transparent conductive thin filmto avoid an influence on a display effect.

The touch layer T is arranged on the side of the encapsulation layer 30facing away from the substrate 00, such that the touch layer T is faraway from the driving device layer 10 and the light emitting devicelayer 20, thereby preventing the electrical signal of the touch layer Tfrom interfering with the driving device layer 10 and the light emittingdevice layer 20

In the embodiment, it is described by assuming that the touch layer T isself-capacitive. In one embodiment, the touch layer T may bemutual-capacitive, which is not limited in the embodiment. In addition,the shape and the size of the touch electrode, and an extensiondirection of the touch wire TL are not limited in the embodiment.

In a manufacturing process of the OLED panel provided in the embodiment,the electrostatic discharge portion 40 and the touch electrode TP can beformed at the same time by patterning the same conductive layer, suchthat it is unnecessary to add an additional process and additionalmaterials to manufacture the electrostatic discharge portion 40, therebybeing beneficial to enhance a manufacturing efficiency and reduce amanufacturing cost for the OLED panel. In addition, the electrostaticdischarge portion 40 and the touch electrode TP are arranged in the samelayer, such that it is unnecessary to add an additional film structure,thereby being beneficial to achieve a light and thin OLED panel.

In the OLED panel provided in the embodiments of the present disclosure,the blocking portion may have various structures. The structure of theblocking portion according to the present disclosure is describedexemplarily hereinafter.

In one embodiment, one structure of the blocking portion is shown inFIG. 3 and FIG. 5. The OLED panel further includes an encapsulationmetal pad 12, and the blocking portion 50 includes packaging adhesive50A.

The encapsulation metal pad and one layer included in the driving devicelayer 10 are formed with a same process. The packaging adhesive 50A islocated on a side of the encapsulation metal pad 12 facing away from thesubstrate 00. The encapsulation layer 30 is attached to the substrate 00through the packaging adhesive 50A.

The electrostatic discharge portion 40 and the packaging adhesive 50A atleast partially overlap in the direction perpendicular to the substrate00.

In the embodiment, the OLED panel is hard. The encapsulation layer 30may be made of a glass substrate, and is attached to the substrate 00and the film structure arranged on the substrate 00 through thepackaging adhesive 50A. It should be noted that the packaging adhesive50A is not in direct contact with the substrate 00. Other film structuremay be arranged between the packaging adhesive 50A and the substrate 00,which is not limited in the embodiment of the present disclosure.

The packaging adhesive 50A is usually made of inorganic glue material.After the packaging adhesive 50A is coated on the substrate, thepackaging adhesive is solidified via a laser. The encapsulation metalpad 12 has a reflection function. The laser irradiates to theencapsulation metal pad 12 and is reflected. At least a part of thereflected light further solidifies the packaging adhesive. Theencapsulation metal pad 12 may enhance a solidifying efficiency of thepackaging adhesive. Since the material contained the electrostaticdischarge portion 40 is the transparent conductive thin film which has agood light transmittance, an influence on a transmittance of the laseris small and an influence on a solidification property of the packagingadhesive 50A is small.

In one embodiment, the encapsulation metal pad 12 and gates of the thinfilm transistors 11 are arranged on the same layer. The encapsulationmetal pad 12 may be a closed loop, or may have a non-closed shape.

In the direction perpendicular to the substrate 00, the electrostaticdischarge portion 40 at least partially overlaps with the packagingadhesive 50A. When the external static electricity enters the OLEDpanel, the static electricity passes the electrostatic discharge portion40 arranged in the non-display area NA. The electrostatic dischargeportion 40 discharges the static electricity, such that the staticelectricity cannot pass the encapsulation layer 30 and the packagingadhesive 50A to reach other film structures of the OLED panel, therebypreventing the external static electricity from damaging the packagingadhesive 50A. Therefore, a failure of the encapsulation glue 50A isprevented and a reliability of the OLED panel is improved.

In addition, when the external static electricity enters the displaypanel from a side close to the encapsulation layer 30, the staticelectricity discharges from the electrostatic discharge portion 40 closeto the encapsulation layer. When the external static electricity entersthe display panel from a side close to the substrate 00, the staticelectricity discharges from the encapsulation metal pad 12 close to thesubstrate 00. The electrostatic discharge portion 40 and theencapsulation metal pad 12 cooperate to prevent the external staticelectricity from entering the blocking portion 50, thereby furtherenhancing the reliability of the OLED panel.

In one embodiment, to improve the solidification property of thepackaging adhesive, the electrostatic discharge portion may have astructure.

In one embodiment, as illustrated in FIG. 6 and FIG. 7, in a case thatthe OLED panel includes the encapsulation metal pad 12 and the packagingadhesive 50A, the electrostatic discharge portion 40 may includemultiple hollowed-out portions 40A. The hollowed-out portions 40Aoverlap with the packaging adhesive 50A in the direction perpendicularto the substrate 00.

In the embodiment, to further reduce the influence of the electrostaticdischarge portion 40 on the transmittance of the laser, the multiplehollowed-out portions 40A are arranged in the electrostatic dischargeportion 40. A part of the laser can pass through the hollowed-outportions 40A to enhance the transmittance of the laser, therebyenhancing the solidification efficiency of the packaging adhesive 50A.

In one embodiment, as illustrated in FIG. 8, at least a part of a wireof the electrostatic discharge portion 40 has a shape of polygonal line.In one embodiment, a region where the packaging adhesive 50A is locatedis illustrated by a dashed box in FIG. 8. The electrostatic dischargeportion 40 is arranged to have the shape of polygonal line, such that anoverlapping area between the electrostatic discharge portion 40 and thepackaging adhesive 50A can be reduced. Therefore, the transmittance ofthe laser is enhanced, and the solidification efficiency of thepackaging adhesive 50A is enhanced. In addition, the shape of polygonalline is beneficial to expand the region where the electrostaticdischarge portion 40 is located, and expand an electrostatic protectionscope of the electrostatic discharge portion 40, thereby furtherenhancing the reliability of the display panel.

In addition, the electrostatic discharge portion 40 is arranged on theside of the encapsulation layer 30 facing away from the substrate 00rather than on a side of the encapsulation layer 30 close to thesubstrate 00, such that the electrostatic discharge portion 40 is nottoo close to the packaging adhesive 50, thereby preventing that in theprocess of solidifying the encapsulation glue 50A by laser, a lot ofgenerated heat burns the electrostatic discharge portion 40.

In one embodiment, another structure of the blocking portion is shown inFIG. 3 and FIG. 9. The blocking portion 50 includes a bank 50B.

The encapsulation layer 30 is a thin film encapsulation layer covering asurface on a side of the bank 50B facing away from the substrate 00.

The electrostatic discharge portion 40 and at least one bank 50B atleast partially overlap in the direction perpendicular to the substrate00.

In the embodiment, the encapsulation layer of the OLED panel is the thinfilm encapsulation (TEE) layer. The thin film encapsulation layer hasboth a good isolating effect and a bendable performance. The use of thethin film encapsulation layer is beneficial to manufacturing of aflexible OLED panel.

In one embodiment, the thin film encapsulation layer includes aninorganic layer 301, an inorganic layer 302, and an organic layer 303.The organic layer 303 is arranged between the two inorganic layers.

The bank 50B is arranged in the non-display area NA. In one embodiment,the bank 50B is annular and is arranged around the display area AA. Inone embodiment, the number of the banks 50B may be two to furtherenhance a blocking effect.

The electrostatic discharge portion 40 is arranged on the side of theencapsulation layer 30 facing away from the substrate 00 rather than onthe side of the encapsulation layer 30 close to the substrate 00, suchthat the electrostatic discharge portion 40 is not too close toconductive structures (such as the anode and the cathode of the OLED,and the signal line) in the display area AA, thereby reducing a couplingcapacitance between the electrostatic discharge portion 40 and theconductive structures in the display area AA, reducing interference onthe conductive structures in the display area AA from the electrostaticdischarge portion 40, and thus improving a display quality.

In the direction perpendicular to the substrate 00, the electrostaticdischarge portion 40 at least partially overlaps with the bank 50B. Whenthe external static electricity enters the OLED panel, the staticelectricity passes the electrostatic discharge portion 40 arranged inthe non-display area NA. The electrostatic discharge portion 40discharges the static electricity, such that the static electricitycannot pass the encapsulation layer 30 and the bank 50B to reach otherfilm structures of the OLED panel, thereby preventing the externalstatic electricity from damaging the bank 50B. Therefore, a failure ofthe bank 50B is prevented and a reliability of the OLED panel isimproved.

In addition, a cathode signal line (which is not illustrated indrawings) that transmits an electrical signal to the cathode of the OLEDis usually arranged in the OLED panel. The cathode signal line isarranged in the non-display area and has a certain static electricitydischarge capacity. The cathode signal line and the sources of the thinfilm transistors are arranged on the same layer. When the externalstatic electricity enters the display panel from the side close to theencapsulation layer 30, the static electricity discharges from theelectrostatic discharge portion 40 close to the encapsulation layer 30.When the external static electricity enters the display panel from theside close to the substrate 00, the static electricity discharges fromthe cathode signal line. The electrostatic discharge portion 40 and thecathode signal line cooperate to prevent the external static electricityfrom entering the blocking portion 50, thereby further enhancing thereliability of the OLED panel.

In one embodiment, the touch layer T is arranged on a side of the thinfilm encapsulation layer facing away from the substrate 00. The touchlayer T includes the touch electrode TP and the touch wire TL.

In the OLED panel according to the embodiments of the presentdisclosure, the electrostatic discharge portion may receive noelectrical signal (in a floating state), or may receive an electricalsignal with a low potential, which is described hereinafter.

In one embodiment, as illustrated in FIG. 1 and FIG. 2, theelectrostatic discharge portion 40 is annular. The electrostaticdischarge portion 40 may receive no electrical signal, i.e., in thefloating state. The external static electricity discharges in theelectrostatic discharge portion 40.

In one embodiment, the electrostatic discharge portion may receive a lowpotential signal. The low potential signal may be a GND signal, a VGLsignal, or a PVEE signal.

Specifically, the GND signal has a ground potential.

A pixel driving circuit is generally arranged in the OLED panel. The VGLsignal is a general signal in the driving circuit. The electrostaticdischarge portion may reuse the VGL signal. Both the display area AA andthe non-display area NA are provided with a signal line configured totransmit the VGL signal.

In the OLED panel, the cathode of the OLED 21 is connected with a fixedvoltage. The fixed voltage is the PVEE signal. Both the display area AAand the non-display area NA are provided with a signal line configuredto transmit the PVEE signal. In one embodiment, the cathode of the OLEDcovers the whole surface. The electrostatic discharge portion may bedirectly electrically connected with the cathode of the OLED.Specifically, as illustrated in FIG. 11, the OLED 21 includes a cathode21A, an anode 21B, and a luminescent material 21C arranged between thecathode 21A and the anode 21B. The cathode 21A of the OLED 21 covers thedisplay area AA and extends to the non-display area NA. Theelectrostatic discharge portion 40 is electrically connected with thecathode 21A through a via hole VIA in the thin film encapsulation layer.Therefore, it is unnecessary to arrange an additional signal line totransmit the electrical signal to the electrostatic discharge portion40, thereby being beneficial to simplify a structure of the OLED panel.

The low potential signal may be transmitted via a conductive bonding padin the OLED panel. The electrostatic discharge portion may be connectedto the conductive bonding pad that provides the low potential signal inmultiple manners.

In some embodiments, as illustrated in FIG. 10 and FIG. 12, the OLEDpanel further includes a bonding area 60 and a flexible printed circuit61. The bonding area 60 includes multiple bonding pads 62. The bondingpads 62 and one layer included in the driving device layer 10 are formedwith a same process, and the flexible printed circuit 61 is electricallyconnected with the bonding pads 62.

The multiple bonding pads 62 include a low potential bonding pad 621,and the electrostatic discharge portion 40 is electrically connectedwith the low potential bonding pad 621.

In one embodiment, the bonding pad 62 and the source and drain of thethin film transistor 11 are arranged in the same layer. The flexibleprinted circuit (FPC) may transmit an electrical signal. The flexibleprinted circuit 61 is electrically connected with the bonding pads 62via conductive adhesive GL.

In one embodiment, the thin film encapsulation layer is adopted in theOLED panel provided in the embodiment. The thin film encapsulation layercovers at least one bank 50B. The electrostatic discharge portion 40covers the bank 50B and extends to the bonding area 60. Theelectrostatic discharge portion 40 is electrically connected with thelow potential bonding pad 621 in the bonding area 60.

In one embodiment, the touch layer T is arranged on the side of the thinfilm encapsulation layer facing away from the substrate 00. The touchlayer T includes the touch electrode TP and the touch wire TL. The touchwire TL may also be electrically connected with the bonding pads 62through the via hole in the thin film encapsulation layer, and theflexible printed circuit 61 transmits the electrical signal for thetouch wire TL, which is not repeated in the embodiment.

The multiple bonding pads 62 include at least one low potential bondingpad 621. The low potential bonding pad 621 receives the low potentialsignal transmitted by the flexible printed circuit 61. Specifically, thelow potential bonding pad transmits the GND signal, the VGL signal, orthe PVEE signal. A bonding pad electrically connected with theelectrostatic discharge portion 40 is the low potential bonding pad.

The flexible printed circuit 61 is not shown in FIG. 10.

In some embodiments, as illustrated in FIG. 13 and FIG. 14, the OLEDpanel further includes an auxiliary bonding area 63 and an auxiliaryflexible printed circuit 64.

The auxiliary bonding area 63 includes multiple auxiliary bonding pads65. The auxiliary flexible printed circuit 64 is electrically connectedwith the auxiliary bonding pads 65. The auxiliary bonding pads 65 arelocated on the side of the encapsulation layer 30 facing away from thesubstrate 00.

The multiple auxiliary bonding pads 65 include a low potential bondingpad 651.

The electrostatic discharge portion 40 is electrically connected withthe low potential bonding pad 651.

In the embodiment, the OLED panel may be hard. The encapsulation layer30 may be made of a glass substrate, and is attached to the substrate 00and the film structure arranged on the substrate 00 through thepackaging adhesive 50A. In one embodiment, the touch layer T is arrangedon the side of the thin film encapsulation layer facing away from thesubstrate 00. The touch layer T includes the touch electrode TP and thetouch wire TL.

The auxiliary bonding pads 65 in the auxiliary bonding area 63 arearranged on the side of the encapsulation layer 30 facing away from thesubstrate 00. The auxiliary flexible printed circuit 64 may beelectrically connected with the auxiliary bonding pads 65 via theconductive adhesive GL.

The auxiliary bonding pads 65 and the touch wire TL may be arranged onthe same film layer. The touch wire TL may be electrically connectedwith the auxiliary bonding pads 65. The auxiliary flexible printedcircuit 64 may transmit an electrical signal for the touch wire TL.

The multiple bonding pads 65 include at least one low potential bondingpad 651. The low potential bonding pad 651 receives the low potentialsignal transmitted by the auxiliary flexible printed circuit 64.Specifically, the low potential bonding pad 651 transmits the GNDsignal, the VGL signal, or the PVEE signal. A bonding pad electricallyconnected with the electrostatic discharge portion 40 is the lowpotential bonding pad 651.

The auxiliary flexible printed circuit 64 is not shown in FIG. 10.

In one embodiment, the OLED panel provided in the embodiment furtherincludes the bonding area 60 and the flexible printed circuit 61. Theauxiliary flexible printed circuit 64 is electrically connected with theflexible printed circuit 61.

In some embodiments, as illustrated in FIG. 15, the OLED panel furtherincludes a polarizer 70 located on a side of the touch layer T facingaway from the substrate 00.

The electrostatic discharge portion 40 includes a first area S1. Theelectrostatic discharge portion 40 in the first area S1 does not overlapwith the polarizer 70 in the direction perpendicular to the substrate00. The electrostatic discharge portion 40 is electrically connectedwith the polarizer 70 through silver adhesive 71, and the silveradhesive 71 is in direct contact with the electrostatic dischargeportion 40 in the first area.

In one embodiment, the polarizer 70 is a low resistance polarizer whichhas a sheet resistance R, where 10∧8Ω≤R≤10∧9Ω.

In the embodiment, the electrostatic discharge portion 40 iselectrically connected with the polarizer 70. When the external staticelectricity enters the OLED panel, the static electricity entering theelectrostatic discharge portion 40 discharges to the polarizer 70 toextend a path in which the static electricity discharges, thereby beingbeneficial to the static electricity discharge. In one embodiment, apolarizer with a low resistance is selected, and the sheet resistance Rof the polarizer is in a range of 10∧8Ω≤R≤10∧9Ω, such that the staticelectricity discharges rapidly in the polarizer, thereby furtherimproving the static electricity protection capacity of the OLED paneland the reliability of the OLED panel.

In one embodiment, as illustrated in FIG. 16, in order to furtherenhance the static discharge capacity of the OLED panel, and enhance thereliability of the OLED panel, the OLED panel further includes anauxiliary static electricity discharge portion 41. The electrostaticdischarge portion 40 is electrically connected with the auxiliaryelectrostatic discharge portion 41. The auxiliary electrostaticdischarge portion 41 and the touch wire TL contain the same material andare arranged on the same layer.

The touch wire TL is usually made of a metal material. The electrostaticdischarge portion 40 is usually made of the transparent conductive thinfilm, such as at least one of indium oxide, zinc oxide, tin oxide, andgallium oxide. A sheet resistance of the metal material is much smallerthan a sheet resistance of the electrostatic discharge portion 40, whichis beneficial to the rapid discharge of the static electricity.

In the embodiment, the auxiliary electrostatic discharge portion 41 iselectrically connected with the electrostatic discharge portion 40, suchthat an equivalent resistance of the auxiliary electrostatic dischargeportion 41 and the electrostatic discharge portion 40 is reduced,thereby being beneficial to the rapid discharge of the staticelectricity, and further improving the reliability of the OLED panel.Besides, in a flexible foldable product, the electrostatic dischargeportion may be broken because of repeated folding. The auxiliaryelectrostatic discharge portion 41 is made of a metal material, has agood extensibility, and is broken with a low probability. In a case thatthe electrostatic discharge portion is broken, the auxiliaryelectrostatic discharge portion 41 connects the broken parts together toreduce a risk of a failure.

In one embodiment, the auxiliary electrostatic discharge portion 41 isannular and is arranged around the display area AA. In anotherembodiment, as illustrated in FIG. 18, FIG. 19, and FIG. 20, theauxiliary electrostatic discharge portion 41 has a shape of grid line.The auxiliary electrostatic discharge portion 41 is arranged to beannular or have the shape of grid line, to reduce an influence of theauxiliary electrostatic discharge portion 41 on the transmittance of thelaser, such that the influence on the transmittance of the laser isreduced, and the influence on the solidification efficiency of thepackaging adhesive 50A is reduced.

In addition, in the manufacturing process of the OLED panel provided inthe embodiment, the auxiliary electrostatic discharge portion 41 and thetouch wire TL can be formed at the same time by patterning the sameconductive layer, such that it is unnecessary to add an additionalprocess and additional materials to manufacture the auxiliaryelectrostatic discharge portion 41, thereby being beneficial to enhancea manufacturing efficiency and reduce a manufacturing cost for the OLEDpanel. In addition, the auxiliary electrostatic discharge portion 41 andthe touch wire TL are arranged on the same layer, such that it isunnecessary to add an additional film structure, thereby beingbeneficial to achieve a light and thin OLED panel.

In the OLED panel provided in the embodiment of the present disclosure,the electrostatic discharge portion 40 and the auxiliary electrostaticdischarge portion 41 may be electrically connected to each other in atleast two manners.

In one embodiment, with reference to FIG. 16 and FIG. 17 continuously, afirst insulating layer TJ is arranged between the electrostaticdischarge portion 40 and the auxiliary electrostatic discharge portion41. The first insulating layer TJ includes multiple first via holes 410,and the electrostatic discharge portion 40 and the auxiliaryelectrostatic discharge portion 41 are electrically connected via thefirst via holes 410. In the embodiment, the number of the first viaholes 410 may be more than one. The greater the number of the first viaholes 410 is, the more beneficial the equivalent resistance of theelectrostatic discharge portion 40 and the auxiliary electrostaticdischarge portion 41 can be reduced, thereby being beneficial to rapidlydischarge the static electricity, and further enhancing the reliabilityof the OLED panel.

In one embodiment, as illustrated in FIG. 18, FIG. 19, and FIG. 20, theauxiliary electrostatic discharge portion 41 has a shape of grid line.In one embodiment, the electrostatic discharge portion 40 covers asurface on a side of the auxiliary electrostatic discharge portion 41facing away from the substrate 00.

In one embodiment, in FIG. 19, the electrostatic discharge portion 40 isprovided with no filling pattern, and is only illustrated by a lineframe. In the embodiment, the electrostatic discharge portion 40directly covers a surface of the auxiliary electrostatic dischargeportion 41 to realize electrical connection, such that a contact area ofthe electrostatic discharge portion 40 and the auxiliary electrostaticdischarge portion 41 becomes larger, thereby being beneficial to reducethe equivalent resistance of the auxiliary electrostatic dischargeportion 41 and the electrostatic discharge portion 40, being beneficialto the rapid discharge of the static electricity, and further enhancingthe reliability of the OLED panel.

In some embodiments, as illustrated in FIG. 21, the OLED panel is anirregular-shaped panel, and the display area AA includes at least onesegment of irregular-shaped edge AY. The electrostatic discharge portion40 includes multiple corners G1, and the corners G1 each have a shape ofrounded corner. In a display panel, the display area AA is rectangular.With the development of display technology, the irregular-shaped displaypanel is favored by consumers. In the irregular-shaped display panel,the display area AA is non-rectangular. The display area AA includes atleast one segment of irregular-shaped edge AY. The irregular-shaped edgemay be a curved segment, or an oblique line segment, which is notlimited in the embodiment. In addition, the corner G1 of theelectrostatic discharge portion 40 has a rounded corner shape ratherthan a right angle shape. If the electrostatic discharge portion 40 hasa right angle shape or a sharp corner shape, a point dischargephenomenon may appear, and the static electricity gathers at the rightangle or the sharp corner, which is not beneficial to the rapiddischarge of the static electricity. The corner G1 of the electrostaticdischarge portion 40 has a shape of rounded corner, which is beneficialto the discharge of the static electricity in the electrostaticdischarge portion.

An OLED device is further provided according to the present disclosure,which includes the OLED panel according to the present disclosure.Reference is made to FIG. 22, which is a schematic structural view of anOLED device according to an embodiment of the present disclosure. Thedisplay device 1000 provided in FIG. 22 includes the display panel 1001according to any one of the above embodiments of the present disclosure.In the embodiment shown by FIG. 22, a mobile phone is taken as anexample to describe the display device 1000. It should be understoodthat the display device provided in the embodiment of the presentdisclosure may be a computer, a television, a vehicle-mounted displaydevice or other display device with a display function, which is notlimited in the present disclosure. The display device provided in theembodiment of the present disclosure has the beneficial effects of thedisplay panel provided in the embodiment of the present disclosure. Forthe beneficial effects, one may refer to the description of the displaypanel in each of the above embodiments, and the beneficial effects arenot repeated in the embodiment.

It should be known from the above embodiments that the OLED panel andthe OLED device provided according to the present disclosure have the atleast the following beneficial effects.

The electrostatic discharge portion can discharge static electricityfrom outside of the OLED panel. The electrostatic discharge portion isarranged in the non-display area and many circuit structures andelectronic elements are arranged in the display area, thereby preventinginterference on the circuit structures and electronic elements in thedisplay area from the electrostatic discharge portion.

The electrostatic discharge portion is located on the side of theencapsulation layer facing away from the substrate. In the non-displayarea, some signal wires or driving circuits are usually arranged betweenthe encapsulation layer and the substrate, and the side of theencapsulation layer facing away from the substrate generally has asimple structure. In order not to increase a width of the non-displayarea, the electrostatic discharge portion is arranged on the side of theencapsulation layer facing away from the e substrate, which isbeneficial to achieve a narrow frame of the OLED panel.

The electrostatic discharge portion is made of the transparentconductive thin film. The transparent conductive thin film is a materialcommonly used in the OLED panel. Since a manufacturing process of thetransparent conductive thin film is relatively mature, a processdifficulty of manufacturing the electrostatic discharge portion can bereduced, and a manufacturing cost of the OLED panel is reduced.

In the direction perpendicular to the substrate, the electrostaticdischarge portion at least partially overlaps with the blocking portion.When the external static electricity enters the OLED panel, the staticelectricity passes the electrostatic discharge portion arranged in thenon-display area. The electrostatic discharge portion discharges thestatic electricity to prevent that the external static electricitydamages the blocking portion. Therefore, a failure of the blockingportion is prevented and a reliability of the OLED panel is improved.

The invention claimed is:
 1. An organic light emitting display panel,comprising: a display area, and a non-display area around the displayarea; a substrate; a driving device layer and a light emitting devicelayer arranged above the substrate, wherein the driving device layer andthe light emitting device layer are located in the display area, thedriving device layer comprises a plurality of thin film transistors, andthe light emitting device layer comprises a plurality of organic lightemitting diodes; an encapsulation layer covering the light emittingdevice layer; a touch layer located on a side of the encapsulation layerfacing away from the substrate; and an auxiliary electrostatic dischargeportion, wherein the non-display area comprises an electrostaticdischarge portion, the electrostatic discharge portion is made of atransparent conductive thin film and is located on the side of theencapsulation layer facing away from the substrate; the non-display areacomprises at least one blocking portion, the blocking portion isarranged around the display area, and the blocking portion is locatedbetween the substrate and the encapsulation layer; the electrostaticdischarge portion and the blocking portion at least partially overlap ina direction perpendicular to the substrate; the touch layer comprises atouch electrode and a touch wire, and the electrostatic dischargeportion and the touch electrode contain a same first material and arearranged on a same first layer; and the electrostatic discharge portionis electrically connected with the auxiliary electrostatic dischargeportion, and the auxiliary electrostatic discharge portion and the touchwire contain a same second material and are arranged on a same secondlayer, wherein the first material is different from the second materialand the first layer is different from the second layer.
 2. The organiclight emitting display panel according to claim 1, further comprising anencapsulation metal pad, wherein the blocking portion comprisespackaging adhesive; the encapsulation metal pad and one layer comprisedin the driving device layer are formed with a same process, thepackaging adhesive is located on a side of the encapsulation metal padfacing away from the substrate, the encapsulation layer is attached tothe substrate through the packaging adhesive; and the electrostaticdischarge portion and the packaging adhesive at least partially overlapin the direction perpendicular to the substrate.
 3. The organic lightemitting display panel according to claim 1, wherein the blockingportion comprises banks; the encapsulation layer is a thin filmencapsulation layer covering a surface on a side of the bank facing awayfrom the substrate; and the electrostatic discharge portion and at leastone of the banks at least partially overlap in the directionperpendicular to the substrate.
 4. The organic light emitting displaypanel according to claim 1, wherein the electrostatic discharge portionis annular and is arranged around the display area.
 5. The organic lightemitting display panel according to claim 2, wherein at least a part ofa wire of the electrostatic discharge portion has a shape of polygonalline.
 6. The organic light emitting display panel according to claim 1,wherein a first insulating layer is arranged between the electrostaticdischarge portion and the auxiliary electrostatic discharge portion, thefirst insulating layer comprises a plurality of first via holes, and theelectrostatic discharge portion and the auxiliary electrostaticdischarge portion are electrically connected via the plurality of firstvia holes.
 7. The organic light emitting display panel according toclaim 1, wherein the electrostatic discharge portion covers a surface ona side of the auxiliary electrostatic discharge portion facing away fromthe substrate.
 8. The organic light emitting display panel according toclaim 1, wherein the auxiliary electrostatic discharge portion isannular and is arranged around the display area.
 9. The organic lightemitting display panel according to claim 1, wherein the auxiliaryelectrostatic discharge portion has a shape of grid line.
 10. Theorganic light emitting display panel according to claim 1, wherein theelectrostatic discharge portion is made of at least one of indium oxide,zinc oxide, tin oxide and gallium oxide.
 11. The organic light emittingdisplay panel according to claim 1, wherein the organic light emittingdisplay panel is an irregular-shaped panel, the display area comprisesat least one segment of irregular-shaped edge; and the electrostaticdischarge portion comprises a plurality of corners, and the plurality ofcorners each have a shape of rounded corner.
 12. An organic lightemitting display device, comprising an organic light emitting displaypanel, wherein the organic light emitting display panel comprises: adisplay area, and a non-display area around the display area; asubstrate; a driving device layer and a light emitting device layerarranged above the substrate, wherein the driving device layer and thelight emitting device layer are located in the display area, the drivingdevice layer comprises a plurality of thin film transistors, and thelight emitting device layer comprises a plurality of organic lightemitting diodes; an encapsulation layer covering the light emittingdevice layer; a touch layer located on a side of the encapsulation layerfacing away from the substrate; and an auxiliary electrostatic dischargeportion, wherein the non-display area comprises an electrostaticdischarge portion, the electrostatic discharge portion is made of atransparent conductive thin film and is located on the side of theencapsulation layer facing away from the substrate; the non-display areacomprises at least one blocking portion, the blocking portion isarranged around the display area, and the blocking portion is locatedbetween the substrate and the encapsulation layer; the electrostaticdischarge portion and the blocking portion at least partially overlap ina direction perpendicular to the substrate; the touch layer comprises atouch electrode and a touch wire, and the electrostatic dischargeportion and the touch electrode contain a same first material and arearranged on a same first layer; and the electrostatic discharge portionis electrically connected with the auxiliary electrostatic dischargeportion, and the auxiliary electrostatic discharge portion and the touchwire contain a same second material and are arranged on a same secondlayer, wherein the first material is different from the second materialand the first layer is different from the second layer.